Our sincere apologies if you receive multiple copies of this announcement. -------------------------------------------------------------------------------- CALL FOR PAPERS Eighth IEEE International Conference on Pervasive Computing and Communications PerCom 2010 (http//www.percom.org/) Mannheim, Germany, March 29 - April 2, 2010 -------------------------------------------------------------------------------- **** Paper Submission --- September 28, 2009 (FIRM DEADLINE) **** Sponsored by IEEE, IEEE Computer Society The University of Texas at Arlington IEEE TCPP, IEEE TCCC -------------------------------------------------------------------------------- IEEE PerCom, now at its eighth edition, is the premier scholarly venue in the areas of pervasive computing and communications, which aim at providing a ubiquitous platform for supporting exciting anytime and anyplace services paradigms. Pervasive computing and communications is a natural outcome of the tremendous advances of a broad spectrum of technologies including wireless networking, sensor networks, mobile and distributed computing, and agent technologies. PerCom 2010 will provide a high profile, leading edge forum for researchers and engineers alike to present state-of-the-art research in the respective fields of pervasive computing and communications. The conference will feature a diverse mixture of presentation forums including core technical sessions, several targeted workshops, demonstrations, keynote speeches and panel discussions from domain experts. TOPICS Research contributions are solicited in all areas pertinent to pervasive computing and communications, including: - Innovative pervasive computing applications - Programming paradigms for pervasive systems - Software evolution and maintenance in pervasive systems - Middleware services and agent technologies - Adaptive, autonomic and context-aware computing - Mobile/Wireless computing systems and services in pervasive computing - Energy-efficient and green pervasive computing - Communication architectures for pervasive computing - Ad hoc networks for pervasive communications - Pervasive opportunistic communications and applications - Enabling technologies for pervasive systems (e.g., wireless BAN, PAN) - Positioning and tracking technologies - Sensors and RFID in pervasive systems - Multimodal sensing and context for pervasive applications - Pervasive sensing, perception and semantic interpretation - Smart devices and intelligent environments - Trust, security and privacy issues in pervasive systems - User interfaces and interaction models - Virtual immersive communications - Wearable computers - Standards and interfaces for pervasive computing environments - Social and economic models for pervasive systems WORKSHOPS AND AFFILIATED EVENTS Many workshops will be held in conjunction with the main conference. Workshop papers will be included and indexed in the IEEE digital libraries (Xplore), showing their affiliation with IEEE PerCom. As in the past, PerCom 2010 will also feature a PhD Forum, Demonstrations and a Work-in-Progress Session. Please visit the conference website for details. SUBMISSION GUIDELINES Submitted papers must be unpublished and not considered elsewhere for publication. Also, they must show a significant relevance to pervasive computing and networking. Guidelines for preparing and submitting the manuscript are available on the conference website (http//www.percom.org/). All papers will be managed electronically through EDAS. Submitted papers will undergo a rigorous review process handled by the Technical Program Committee. MARK WEISER AWARD The best paper will receive the prestigious Mark Weiser Best Paper Award. Papers of particular merit will be considered for a special issue of the Elsevier journal of Pervasive and Mobile Computing (PMC). IMPORTANT DATES Paper Registration: Sept. 25, 2009 Paper Submission: Sept. 28, 2009 (FIRM DEADLINE) Author notification: Dec. 21, 2009 Camera-ready due: Jan. 29, 2010 For further Information, please contact Giuseppe Anastasi at <giuseppe.anastasi@iet.unipi.it> or visit the conference website (http://www.percom.org) ORGANIZING COMMITTEE General Co-chairs: Christian Becker, University of Mannheim, Germany Marco Conti, National Research Council, Italy Program Chair: Giuseppe Anastasi, University of Pisa, Italy Program Vice Chairs: Yonghe Liu, University of Texas at Arlington, USA Daniela Nicklas, University of Oldenburg, Germany Steve Ward, MIT, USA Steering Committee Chair: Mohan Kumar, University of Texas at Arlington, USA Workshops Co-chairs: Jalal Al Muhtadi, King Saud University, Saudi Arabia Andrea Passarella, National Research Council, Italy Keynotes Chair: Vinny Cahill, Trinity College Dublin, Ireland Panels Chair: Djamshid Tavangarian, University of Rostock, Germany Work in Progress Chair: Achilles Kameas, University of Patras, Greece Joerg Ott, Helsinky University of Technology, Finland Demo Co-chairs: Qi Han, Colorado School of Mines, USA Pedro Jose Marron, University of Bonn, Germany Ph.D. Forum Chair: Claudio Bettini, University of Milan, Italy Industrial Relations Co-chairs: Paul Castro, IBM, USA Igor Curcio, Nokia, Finland York Sure, SAP AG, Germany Finance and Registration Chair: Gergely Záruba, University of Texas at Arlington, USA Publication Chair: Emilio Ancillotti, National Research Council, Italy Alessio Vecchio, University of Pisa, Italy Publicity Co-chairs: Franca Delmastro, National Research Council, Italy Dinh Q. Phung, Curtin University of Technology, Australia Damla Turgut, University of Central Florida, USA Zhiwen Yu, Northwestern Polytechnical University, China Local Arrangements Chair: Gregor Schiele, University of Mannheim, Germany Submission Chair: Antonio Pinizzotto, National Research Council, Italy Website Liaison: Nayantara (Tara) Mallesh, University of Texas at Arlington, USA TECHNICAL PROGRAM COMMITTEE: Jalal Al Muhtadi, King Saud University, Saudi Arabia Habib Ammari, Hofstra University, USA Francisco Ballestreros, Rey Juan Carlos University, Spain Stefano Basagni, Northeastern University, USA Martin Bauer, NEC Europe, Germany Paolo Bellavista, University of Bologna, Italy Claudio Bettini, University of Milan, Italy Chatschik Bisdikian, IBM TJ Watson Research, USA Susanne Boll, University of Oldenburg, Germany Luciano Bononi, University of Bologna, Italy Roy Campbell, University of Illinois at Urbana-Champaign, USA Jiannong Cao, Hong Kong Polytechnic University, HK Guohong Cao, Pennsylvania State University, USA Surendar Chandra, University of Notre Dame, USA Yingying Chen, Stevens Institute of Technology, USA Diane J. Cook, Washington State University, USA Paolo Costa, Microsoft Research, UK Franca Delmastro, National Research Council, Italy Karoly Farkas University of West Hungary, Hungary Christian Floerkemeier, MIT, USA Silvia Giordano, SUSPI, Switzerland Tao Gu, University of Southern Denmark, Denmark Isabelle Guérin Lassous, Université Lyon I/LIP, France Qi Han, Colorado School of Mines, USA Robert Harle, University of Cambridge, UK Wenbo He, University of New Mexico, USA Urs Hengartner, University of Waterloo, Canada Manfred Huber, University of Texas at Arlington, USA Jadwiga Indulska, University of Queensland Brisbane, Australia Vana Kalogeraki, University of California, Riverside, USA Achilles Kameas, University of Patras, Greece Birgitta König-Ries, Universität Jena, Germany Polychronis Koutsakis, Technical University of Crete, Greece Mohan Kumar, University of Texas at Arlington, USA Bob Kummerfeld, University of Sydney, Australia Brent Lagesse, University of Texas at Arlington, USA, Seng W. Loke, La Trobe University, Australia Ulrike Lucke University of Rostock, Germany Paul Lukowicz, University of Passau, Germany Xun Luo, Qualcomm Inc., USA Marco Mamei, Università di Modena e Reggio Emilia, Italy Cecilia Mascolo, University of Cambridge, UK Martin Mauve, Heinrich Heine University Düsseldorf, Germany Scott Midkiff, Virginia Tech, USA Bernhard Mitschang, University of Stuttgart, Germany Refik Molva, Eurecom, France Paul Muller, University of Kaiserslautern, Germany Matt Mutka, Michigan State University, USA Klara Nahrstedt, University of Illinois Urbana-Champaign, USA Lionel M. Ni, Hong Kong University of Science & Technology, HK Joerg Ott, Helsinki University of Technology, Finland Justin Mazzola Paluska, MIT, USA, Symeon Papavassiliou, National Technical University of Athens, Greece Andrea Passarella, National Research Council, Italy Tom Pfeifer, Waterford Institute of Technology, Ireland Gian Pietro Picco, University of Trento, Italy Claudio Pinhanez, IBM T.J. Watson Research Center, USA Dinh Phung, Curtin University of Technology, Australia Mandayam Raghunath, Google, India Tirumale Ramesh, Boeing, USA Anand Ranganathan, IBM T.J. Watson Research Center, USA Nishkam Ravi, Intel, Santa Clara, USA Daniele Riboni, University of Milan, Italy Kay Roemer, ETH Zurich, Switzerland Alex Rogers, Southampton University, UK George Roussos, Birkbeck College, University of London, UK Nirmalya Roy, University of Texas at Austin, USA Enrico Rukzio, Lancaster University, UK Ichiro Satoh, National Institute of Informatics, Japan Gregor Schiele, University of Mannheim, Germany Albrecht Schmidt, University of Duisburg-Essen, Germany Fabio A. Schreiber, Polytechnic of Milan, Italy Behrooz Shirazi, Washington State University, USA Morris Sloman, Imperial College London, UK, Ioannis Stavrakakis, National and Kapodistrian Univ. of Athens, Greece Thomas Strang, German Aerospace Center, Germany Gerhard Tröster, ETH Zürich, Switzerland Gene Tsudik, University of California at Irvine, USA Alessio Vecchio, University of Pisa, Italy Nalini Venkatasubramamian, University of California at Irvine, USA Matthew Wright, University of Texas at Arlington, USA Li Xiao, Michigan State University, USA David Yates, Bentley University, USA Franco Zambonelli, University of Modena and Reggio, Italy Gergely Zaruba, University of Texas at Arlington, USA Daqing Zhang, GET/INT-National Institute of Telecommunications, France Yanchao Zhang, New Jersey Institute of Technology, USA