Second International Workshop on Artificial Intelligence for 3D Big Spatial Data Processing (AI3D 2019) ************************************************************************************************************* Co-located with IEEE ISM 2019, San Diego, California, USA, December 9-11, 2019 Weblink: https://sites.google.com/view/ai3d2019/home Recent advances in laser technology has evolved the importance of 3D spatial data and challenges considering is processing and management. 3D spatial data is usually generated as a stream of points by mounting scanning equipment on drones and cars for large area scanning or on some stationary platform for small area scanning or indoor scanning. The 3D spatial data offer a useful source of information for natural resource management, urban planning, autonomous driving, etc. Artificial intelligence (AI) has the potential to take the 3D spatial data processing into hypergrowth. Recently, 3D indoor mapping systems, terrestrial mobile mapping systems (MMS) and airborne LiDAR systems are capable of collecting terabytes of data (including images and point clouds) in a single scan or on a single trip. Existing approaches and tools lack the efficient management, processing and analysis of 3D spatial data. The solution to this problem lies in the use of Artificial Intelligence and Deep Learning to redefine the workflow. This workshop focuses on the use of Artificial Intelligence and Deep Learning to improve the processing, management and analysis of 3D Big Spatial data. The workshop aims at providing a platform to the group of researchers working in this direction to share their work, exchange ideas, and solve research problems. Topics of Interest ****************** A list of topics of interest includes but is not limited to: AI and the 3D scanning technologies and devices Use of AI in 3D view registration and surface modeling Intelligent LiDAR data processing, management and analysis Point cloud data processing and analysis Spatio-temporal data processing and analysis Geo spatial data processing and analysis Distributed, parallel and peer-to-peer approaches to index, search and process 3D Big spatial data AI based object detection from point cloud and images Supervised/Unsupervised object annotation in 3D data Point cloud data indexing and querying 3D Big spatial data architectures 3D Big spatial data visualization and analytics 3D Big spatial data cleaning, compression and integration Geographic Information Retrieval Indoor and outdoor mapping 3D mapping Urban Planning Spatial data applications User Interfaces and Visualization AI3D 2019 Special Journal Issues ********************************************** Accepted and presented papers at AI3D2019 will be considered for publication in Special Issues of the International Journals. Authors of the selected AI3D 2019 workshop papers will be invited to submit their work with further revision and extension to the special issues of the following journal: 1- Sensors (Special Issue for AI3D 2019) --------------------------------------- The sensors is an Open Access journal with High Visibility (indexed by the Science Citation Index Expanded, MEDLINE, Ei Compendex, Inspec and Scopus) and High Impact Factor (2.475 (2017) ; 3.014 (5-Years)). 1- Remote Sensing (Special Issue for Data Science, Artificial Intelligence and Remote Sensing) The remote sensing is an Open Access journal with High Visibility (Science Citation Index Expanded, Scopus, Ei Compendex, and others) and High Impact Factor (3.406 (2017) ; 3.952 (5-Years)). Submission Instructions and Review Process ********************************************** Authors are invited to submit an 8-page (regular), 4-page (short), and 2-4 page (vision or on-going) manuscript in double-column IEEE format. Manuscripts must be written in English and follow the instructions in the Manuscript Formatting and Templates page. Document templates are located at: --------------------------------------- Word ( http://media.wix.com/ugd/346a54_3feb3b10846a4532951e3fcae6767fae.doc?dn=MSW_... ) LaTeX (http://ism2017.asia.edu.tw/wp-content/uploads/2017/01/ieeetran5.zip) LaTeX (Bibliography Files) ( http://ism2017.asia.edu.tw/wp-content/uploads/2017/01/ieeetranbst1.zip) All paper submissions will be carefully reviewed by at least three experts and reviews will be returned to the author(s) with comments to ensure the high quality of the accepted papers. The authors of accepted papers must guarantee that their paper will be presented at the workshop. Please only submit original material where copyright of all parts is owned by the authors declared and which is not currently under review elsewhere. Please see the IEEE policies for further information. Manuscript Submission Instructions: ---------------------------------------- Only electronic submission will be accepted. Technical paper authors MUST submit their manuscripts through EasyChair. Manuscripts may only be submitted in PDF format. Camera-ready Submission Instructions: ------------------------------------------- Your final papers MUST be formatted to IEEE Computer Society Proceedings Manuscript Formatting Guidelines (see the templates listed earlier). It is highly recommended that you proofread and check the layout of your paper BEFORE submitting. Note: Every paper accepted for publication in the Proceedings MUST be presented during the workshop. Every paper accepted MUST have attached to it at least one registration at the full member/nonmember rate. Thus, for a paper for which all authors are students, one student author will be required to register at the full registration rate. Failure to do so will result in removal of your paper from the conference proceedings. Regular workshop papers allow up to 2 extra pages and short papers up to 1 extra page with $150 per extra page. Contribution Types: ---------------------- Full research paper: 8 pages Short research paper: 4 pages Vision or on-going research paper: 2-4 pages Key Dates: ----------- Paper submission deadline: September 22, 2019 Notification of acceptance: October 21, 2019 Camera ready deadline: October 31, 2019 Workshop date: December 9, 2019 Organization Committee ************************** General Co-Chairs: ------------------ Prof. Dr. Sisi Zlatanova, UNSW, Australia Dr. Kyoung-Sook Kim, AIRC, AIST, Japan Program Co-Chairs: ------------------ Dr. Salman Ahmed Shaikh, AIRC, AIST, Japan Dr. Jun Lee, AIRC, AIST, Japan PC Members: ----------- Prof Dr. Liangliang Nan, TU Delft, Netherlands Prof. Dr. Adam Jatowt, Kyoto University, Japan Dr. Akiyoshi Matono, AIRC, AIST, Japan Dr. Jianquan Liu, NEC, Japan Prof. Dr. Omar Arif, NUST, Pakistan Prof. Dr. Mohsin Memon, MUET, Pakistan Dr. Savong Bou, Toyota Technological Institute, Japan Dr. Chidchanok Choksuchat, Prince of Songkla University, Thailand Dr. Yuyang Dong, NEC, Japan More to be added For any query, contact us at: ai3d2019-ml@aist.go.jp **************************************************** Best Regards, --- Salman Ahmed Shaikh Research Scientist Artificial Intelligence Research Center (AIRC) National Institute of Advanced Industrial Science and Technology (AIST) Tokyo Waterfront 2-4-7 Aomi, Koto-ku, Tokyo 135-0064 JAPAN